{"id":33002,"date":"2026-08-13T07:40:15","date_gmt":"2026-08-13T05:40:15","guid":{"rendered":"https:\/\/www.md-elektronik.com\/?p=33002"},"modified":"2026-08-13T09:16:19","modified_gmt":"2026-08-13T07:16:19","slug":"high-frequency-integrated-multi-hybrid-connector-systems","status":"publish","type":"post","link":"https:\/\/www.md-elektronik.com\/en\/high-frequency-integrated-multi-hybrid-connector-systems\/","title":{"rendered":"High Frequency Integrated Multi-Hybrid Connector Systems"},"content":{"rendered":"\n\t<div class=\"img has-hover x md-x lg-x y md-y lg-y\" id=\"image_1587210969\">\n\t\t\t\t\t\t\t\t<div class=\"img-inner dark\" >\n\t\t\t<img decoding=\"async\" width=\"800\" height=\"534\" src=\"https:\/\/www.md-elektronik.com\/wp-content\/uploads\/2026\/08\/0054_bordnetze_260505.jpg\" class=\"attachment-large size-large\" alt=\"\" srcset=\"https:\/\/www.md-elektronik.com\/wp-content\/uploads\/2026\/08\/0054_bordnetze_260505.jpg 800w, https:\/\/www.md-elektronik.com\/wp-content\/uploads\/2026\/08\/0054_bordnetze_260505-300x200.jpg 300w, https:\/\/www.md-elektronik.com\/wp-content\/uploads\/2026\/08\/0054_bordnetze_260505-768x513.jpg 768w\" sizes=\"(max-width: 800px) 100vw, 800px\" \/>\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\n<style>\n#image_1587210969 {\n  width: 100%;\n}\n<\/style>\n\t<\/div>\n\t\n\n\t<div id=\"gap-1813167583\" class=\"gap-element clearfix\" style=\"display:block; height:auto;\">\n\t\t\n<style>\n#gap-1813167583 {\n  padding-top: 30px;\n}\n<\/style>\n\t<\/div>\n\t\n\n<p>At the 14th International Conference on Automotive Wire Harness &amp; EDS in Ludwigsburg, MD ELEKTRONIK and Bosch jointly held a presentation on \u201c<em>High Frequency Integrated Multi-Hybrid Connector Systems for Future E\/E Architectures<\/em>\u201d highlighting jointly developed multi-hybrid connector systems that already meet demanding OEM specifications for automotive applications. The presentation was given by Martin Hager, Director Center of Competence Mechanical Engineering (ME\/ECO-ME) at Bosch Mobility Electronics, and Helmut Pritz, Manager Technical Product Management (Optical Transmission, Multi-Hybrid Connectors) at MD ELEKTRONIK.<\/p>\n<div class=\"message-box relative table-of-contents-message-box\" style=\"padding-top:30px;padding-bottom:30px;\"><div class=\"message-box-bg-image bg-fill fill\" ><\/div><div class=\"message-box-bg-overlay bg-fill fill\" ><\/div><div class=\"container relative\"><div class=\"inner last-reset\">\n\n<div class=\"row align-equal align-center\"  id=\"row-1683548271\">\n\n\n\t<div id=\"col-2001483337\" class=\"col small-12 large-12\"  >\n\t\t\t\t<div class=\"col-inner\"  >\n\t\t\t\n\t\t\t<script type=\"text\/javascript\">\n\tvar dpc_lang = 'en';\n\tvar dpc_current_language = 'en';\n\tvar dpc_plugin_url = 'https:\/\/www.md-elektronik.com\/wp-content\/plugins\/delucks-seo';\n    var ajaxurl = 'https:\/\/www.md-elektronik.com\/wp-admin\/admin-ajax.php';\n<\/script>\n\n\n\n\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\n\t\n\n<\/div>\n\n<\/div><\/div><\/div>\n\t<div id=\"gap-951739268\" class=\"gap-element clearfix\" style=\"display:block; height:auto;\">\n\t\t\n<style>\n#gap-951739268 {\n  padding-top: 30px;\n}\n<\/style>\n\t<\/div>\n\t\n\n<h2>Cooperation between Bosch und MD ELEKTRONIK\u00a0<\/h2>\n<p>The collaboration between the two companies focuses on two core solutions: Microflex and Moduflex. These systems enable flexible modularization of future on-board networks and simplify harness separation on both the <a href=\"https:\/\/www.md-elektronik.com\/en\/cable-assembly\/\">cable assembly<\/a> and ECU sides. MD ELEKTRONIK develops and manufactures the high-frequency contact technologies, such as Shielded Twisted Pair and Mini <a href=\"https:\/\/www.md-elektronik.com\/en\/coax\/\">Coax<\/a>, specifically for the PCB interface in accordance with the respective requirements.<\/p>\n\n\n<!-- Key drivers \u2013 nur Markup. Styles liegen im Global Custom CSS.\n     \u00dcbersetzbar ist ausschlie\u00dflich der Text zwischen den Tags. -->\n\n<table class=\"ee-drivers\">\n  <caption>The key drivers of future E\/E architectures<\/caption>\n  <tbody>\n\n    <tr>\n      <td>\n        <h3 class=\"ee-drivers__head\">Software Defined Vehicle (SDV)<\/h3>\n        <ul class=\"ee-drivers__list\">\n          <li>Centralization of software functions<\/li>\n          <li>Separation of hardware and software development<\/li>\n          <li>OTA updates and new digital services<\/li>\n        <\/ul>\n      <\/td>\n      <td>\n        <h3 class=\"ee-drivers__head\">Increasing data rates<\/h3>\n        <ul class=\"ee-drivers__list\">\n          <li>Multi-gigabit Ethernet<\/li>\n          <li>Sensor fusion for <a href=\"https:\/\/www.md-elektronik.com\/en\/autonomous-driving\/\">autonomous driving<\/a><\/li>\n          <li>Real-time communication<\/li>\n          <li>High-resolution cameras<\/li>\n        <\/ul>\n      <\/td>\n      <td>\n        <h3 class=\"ee-drivers__head\">New on-board system requirements<\/h3>\n        <ul class=\"ee-drivers__list\">\n          <li>Higher pin densities<\/li>\n          <li>Less installation space<\/li>\n          <li>EMC optimization<\/li>\n          <li>Automated manufacturing<\/li>\n          <li>Scalability and modularity<\/li>\n          <li>De-meshing<\/li>\n        <\/ul>\n      <\/td>\n    <\/tr>\n\n    <tr>\n      <td>\n        <h3 class=\"ee-drivers__head\">Safety &amp; security<\/h3>\n        <ul class=\"ee-drivers__list\">\n          <li>Compliance with various ASIL levels<\/li>\n        <\/ul>\n      <\/td>\n      <td>\n        <h3 class=\"ee-drivers__head\">Manufacturability and process robustness<\/h3>\n        <ul class=\"ee-drivers__list\">\n          <li>Reliability in the field is of critical importance<\/li>\n          <li>Re-use of existing manufacturing processes (stitching)<\/li>\n        <\/ul>\n      <\/td>\n      <td>\n        <h3 class=\"ee-drivers__head\">Variant and cost management<\/h3>\n        <ul class=\"ee-drivers__list\">\n          <li>Flexibility through standardized connectors and module sizes<\/li>\n          <li>Ensuring high-volume supply<\/li>\n        <\/ul>\n      <\/td>\n    <\/tr>\n\n  <\/tbody>\n<\/table>\n\n\t<div id=\"gap-433366004\" class=\"gap-element clearfix\" style=\"display:block; height:auto;\">\n\t\t\n<style>\n#gap-433366004 {\n  padding-top: 15px;\n}\n<\/style>\n\t<\/div>\n\t\n\n<h2><strong>Modularization and High Frequency Integration in Connector Systems <\/strong><\/h2>\n<p>The most widely used connector systems in the automotive industry were often developed at a time when data rates and on-board network concepts imposed significantly lower requirements. One of the greatest challenges currently being faced is the integration of high-frequency contacts directly into modular connector systems. This is precisely where the joint development by Bosch and MD ELEKTRONIK comes into play. Both solution concepts focus on advancing connector systems toward greater modularization and high-frequency (HF) integration.<\/p>\n\t<div class=\"img has-hover x md-x lg-x y md-y lg-y\" id=\"image_1481953681\">\n\t\t\t\t\t\t\t\t<div class=\"img-inner dark\" >\n\t\t\t<img decoding=\"async\" width=\"819\" height=\"330\" src=\"https:\/\/www.md-elektronik.com\/wp-content\/uploads\/2026\/08\/hf_developnemt_ziffern.png\" class=\"attachment-original size-original\" alt=\"\" srcset=\"https:\/\/www.md-elektronik.com\/wp-content\/uploads\/2026\/08\/hf_developnemt_ziffern.png 819w, https:\/\/www.md-elektronik.com\/wp-content\/uploads\/2026\/08\/hf_developnemt_ziffern-300x121.png 300w, https:\/\/www.md-elektronik.com\/wp-content\/uploads\/2026\/08\/hf_developnemt_ziffern-768x309.png 768w\" sizes=\"(max-width: 819px) 100vw, 819px\" \/>\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\n<style>\n#image_1481953681 {\n  width: 100%;\n}\n<\/style>\n\t<\/div>\n\t\n\n\t<div id=\"gap-1057435554\" class=\"gap-element clearfix\" style=\"display:block; height:auto;\">\n\t\t\n<style>\n#gap-1057435554 {\n  padding-top: 30px;\n}\n<\/style>\n\t<\/div>\n\t\n\n<ol>\n<li><strong>Connector for HF applications (<\/strong>Catalog product)<\/li>\n<li><strong>Integrated multipin connector wth HF contacts (various <a href=\"https:\/\/www.md-elektronik.com\/en\/shielding\/\">shielding<\/a> options)<\/strong><\/li>\n<li><strong>Fully integrated multipin connector with HF contacts, separate shielding (example)<\/strong><\/li>\n<li><strong>Fully integrated modular connector with HF contacts (separate shielding)<\/strong><\/li>\n<\/ol>\n<p>The key technical drivers and challenges for optimized multi-hybrid connector systems arise primarily from the increasing requirements of modern E\/E architectures. The growing number of functions, <a href=\"https:\/\/www.md-elektronik.com\/en\/sensors\/\">sensors<\/a>, and data channels requires a high packing density within limited installation space. At the same time, the combination of low-speed and high-speed contacts makes targeted pin optimization essential to reliably integrate power supply and high-frequency data transmission within a single system. Optimized assembly and interconnection technologies for integration into central electronic control units (ECUs) are also becoming increasingly important as control units continue to shrink in size. Simplified PCB assembly and fewer mating operations help reduce manufacturing time and potential sources of error. In addition, insertion forces must be reduced to facilitate assembly and prevent damage. Overall, the focus is on lower complexity, greater reliability, and fully automated, robust series production.<\/p>\n\t<div id=\"gap-1357471736\" class=\"gap-element clearfix\" style=\"display:block; height:auto;\">\n\t\t\n<style>\n#gap-1357471736 {\n  padding-top: 30px;\n}\n<\/style>\n\t<\/div>\n\t\n\n<h2><strong>Microflex and Moduflex: Solution Concepts for Multi-Hybrid Connector Systems<\/strong><\/h2>\n\t<div class=\"img has-hover x md-x lg-x y md-y lg-y\" id=\"image_1237680381\">\n\t\t\t\t\t\t\t\t<div class=\"img-inner dark\" >\n\t\t\t<img decoding=\"async\" width=\"1372\" height=\"759\" src=\"https:\/\/www.md-elektronik.com\/wp-content\/uploads\/2026\/08\/Microflex_-Moduflex-.jpg\" class=\"attachment-original size-original\" alt=\"\" srcset=\"https:\/\/www.md-elektronik.com\/wp-content\/uploads\/2026\/08\/Microflex_-Moduflex-.jpg 1372w, https:\/\/www.md-elektronik.com\/wp-content\/uploads\/2026\/08\/Microflex_-Moduflex--300x166.jpg 300w, https:\/\/www.md-elektronik.com\/wp-content\/uploads\/2026\/08\/Microflex_-Moduflex--1024x566.jpg 1024w, https:\/\/www.md-elektronik.com\/wp-content\/uploads\/2026\/08\/Microflex_-Moduflex--768x425.jpg 768w\" sizes=\"(max-width: 1372px) 100vw, 1372px\" \/>\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\n<style>\n#image_1237680381 {\n  width: 100%;\n}\n<\/style>\n\t<\/div>\n\t\n\n<p>With <strong>Microflex<\/strong> and <strong>Moduflex<\/strong>, Bosch and MD ELEKTRONIK have jointly developed two solution concepts for modern multi-hybrid connector systems.<\/p>\n<p>The first solution is based on multipin headers with integrated HF connectors using state-of-the-art soldering technology, while the second solution employs fully integrated modular pin headers with HF contacts based on Press-Fit technology. Both concepts utilize separate shielding, enabling high-performance and scalable integration of high frequency and signal transmission in modern on-board network architectures, particularly in EMC-critical areas (e.g., where potential differences or different current levels for cameras occur).<\/p>\n<p>To meet the demanding requirements for data rates, packing density, and signal integrity, targeted system-level improvements were implemented. Optimizations in Press-Fit technology, tolerance management, shielding design, and fixation elements improve return loss, shielding effectiveness, and coupling attenuation. At the same time, a precisely coordinated overall design enables accurate positioning of pins and PCB drill holes while accommodating a large number of HF modules within the available installation space. This is complemented by optimized PCB routing and extended coding options, allowing flexible integration of different cable modules and variants.<\/p>\n\t<div id=\"gap-355221701\" class=\"gap-element clearfix\" style=\"display:block; height:auto;\">\n\t\t\n<style>\n#gap-355221701 {\n  padding-top: 30px;\n}\n<\/style>\n\t<\/div>\n\t\n\n<h2><strong>Test Results<\/strong><\/h2>\n<p>The high-frequency and mechanical tests performed confirmed the performance of the developed <strong>Microflex<\/strong> and \u00a0<strong>Moduflex<\/strong> multi-hybrid connector systems at the individual component level in accordance with the relevant IEEE, OPEN Alliance, and USCAR standards.<\/p>\n\n\n<section class=\"ee-tests\">\n  <div class=\"ee-tests__grid\">\n\n    <details class=\"ee-tests__card ee-tests__card--signal\" open>\n      <summary><span class=\"ee-tests__title\">High frequency tests<\/span><\/summary>\n      <div class=\"ee-tests__body\">\n\n        <details open>\n          <summary>Differential connectors<\/summary>\n          <div class=\"ee-tests__body\">\n\n            <div class=\"ee-tests__row\">\n              <div class=\"ee-tests__what\">\n                <span class=\"ee-tests__name\">Return loss<\/span>\n                <span class=\"ee-tests__std\">OPEN Alliance TC9 10BASE-T1<\/span>\n              <\/div>\n              <div class=\"ee-tests__result\">\n                <ul class=\"ee-tests__values\">\n                  <li>IEEE 802.3ch (2,5 GHz \/ 5 Gbit\/s &middot; 4 GHz \/ 10 Gbit\/s)<\/li>\n                  <li>IEEE 802.3cy (9 GHz \/ 25 Gbit\/s)<\/li>\n                <\/ul>\n              <\/div>\n            <\/div>\n\n            <div class=\"ee-tests__row\">\n              <div class=\"ee-tests__what\">\n                <span class=\"ee-tests__name\">Shielding effectiveness<\/span>\n                <span class=\"ee-tests__std\">OPEN Alliance TC9 10BASE-T1<\/span>\n              <\/div>\n              <div class=\"ee-tests__result\">\n                <ul class=\"ee-tests__values\">\n                  <li>LogMag(s21) &gt; &minus;50 dB (0&ndash;25 Gbit\/s)<\/li>\n                <\/ul>\n              <\/div>\n            <\/div>\n\n          <\/div>\n        <\/details>\n\n        <details>\n          <summary>Mini Coax connectors<\/summary>\n          <div class=\"ee-tests__body\">\n\n            <div class=\"ee-tests__row\">\n              <div class=\"ee-tests__what\">\n                <span class=\"ee-tests__name\">Return loss<\/span>\n                <span class=\"ee-tests__std\">USCAR-49 Rev. 1, October 2024<\/span>\n              <\/div>\n              <div class=\"ee-tests__result\">\n                <ul class=\"ee-tests__values\">\n                  <li><a href=\"https:\/\/www.md-elektronik.com\/en\/fpd-link\/\">FPD-Link<\/a> III (2,4 GHz \/ ~3,4 Gbit\/s)<\/li>\n                  <li>GMSL3 (3,5 GHz \/ ~12 Gbit\/s)<\/li>\n                  <li>FPD-Link IV (4,25 GHz \/ ~6 Gbit\/s)<\/li>\n                <\/ul>\n              <\/div>\n            <\/div>\n\n            <div class=\"ee-tests__row\">\n              <div class=\"ee-tests__what\">\n                <span class=\"ee-tests__name\">Shielding effectiveness<\/span>\n                <span class=\"ee-tests__std\">USCAR-49 Rev. 1, October 2024<\/span>\n              <\/div>\n              <div class=\"ee-tests__result\">\n                <ul class=\"ee-tests__values\">\n                  <li>LogMag(s21) &gt; &minus;60 dB (0&ndash;9 GHz)<\/li>\n                <\/ul>\n              <\/div>\n            <\/div>\n\n          <\/div>\n        <\/details>\n\n      <\/div>\n    <\/details>\n\n    <details class=\"ee-tests__card ee-tests__card--gear\" open>\n      <summary><span class=\"ee-tests__title\">Mechanical tests<\/span><\/summary>\n      <div class=\"ee-tests__body\">\n\n        <p class=\"ee-tests__intro\">\n          The mechanical test results meet the typical requirements for automotive\n          on-board network connectors in accordance with USCAR-2.\n        <\/p>\n\n        <div class=\"ee-tests__row\">\n          <div class=\"ee-tests__what\">\n            <span class=\"ee-tests__name\">Connector mating \/ unmating force<\/span>\n          <\/div>\n          <div class=\"ee-tests__result\">\n            <ul class=\"ee-tests__values\">\n              <li>Complete connector system: &lt; 75 N <span class=\"ee-tests__pass\">passed<\/span><\/li>\n            <\/ul>\n          <\/div>\n        <\/div>\n\n        <div class=\"ee-tests__row\">\n          <div class=\"ee-tests__what\">\n            <span class=\"ee-tests__name\">Contact insertion force<\/span>\n          <\/div>\n          <div class=\"ee-tests__result\">\n            <ul class=\"ee-tests__values\">\n              <li>Mini Coax component: &lt; 12 N <span class=\"ee-tests__pass\">passed<\/span><\/li>\n            <\/ul>\n          <\/div>\n        <\/div>\n\n        <div class=\"ee-tests__row\">\n          <div class=\"ee-tests__what\">\n            <span class=\"ee-tests__name\">Contact retention force<\/span>\n          <\/div>\n          <div class=\"ee-tests__result\">\n            <ul class=\"ee-tests__values\">\n              <li>Differential component: &gt; 110 N <span class=\"ee-tests__pass\">passed<\/span><\/li>\n            <\/ul>\n          <\/div>\n        <\/div>\n\n        <div class=\"ee-tests__row\">\n          <div class=\"ee-tests__what\">\n            <span class=\"ee-tests__name\">Secondary lock actuation force<\/span>\n          <\/div>\n          <div class=\"ee-tests__result\">\n            <ul class=\"ee-tests__values\">\n              <li>Differential component: &lt; 30 N <span class=\"ee-tests__pass\">passed<\/span><\/li>\n            <\/ul>\n          <\/div>\n        <\/div>\n\n      <\/div>\n    <\/details>\n\n  <\/div>\n<\/section>\n\n\t<div id=\"gap-1461634506\" class=\"gap-element clearfix\" style=\"display:block; height:auto;\">\n\t\t\n<style>\n#gap-1461634506 {\n  padding-top: 30px;\n}\n<\/style>\n\t<\/div>\n\t\n\n<h2><strong>Summary of the Benefits of Multi-Hybrid Connector Systems<\/strong><\/h2>\n<p>The presented multi-hybrid connector systems meet the key requirements of future E\/E architectures and provide the foundation for more powerful, flexible, and efficient vehicle platforms. At the same time, they support a greater degree of standardization of interfaces and processes throughout the entire value chain\u2014from control unit integration to on-board network assembly.<\/p>\n<div class=\"row\"  id=\"row-814291064\">\n\n\n\t<div id=\"col-771895551\" class=\"col small-12 large-12\"  >\n\t\t\t\t<div class=\"col-inner\"  >\n\t\t\t\n\t\t\t\n\n\n\n<!-- OEM \/ Standardization \u2013 nur Markup. Styles liegen im Global Custom CSS. -->\n\n<section class=\"ee-oem\" aria-labelledby=\"ee-oem-bar\">\n\n  <div class=\"ee-oem__bar\" id=\"ee-oem-bar\">OEM<\/div>\n\n  <div class=\"ee-oem__grid\">\n\n    <div class=\"ee-oem__col\">\n      <h3 class=\"ee-oem__head\">Tier 1 (ECU)<\/h3>\n      <ul class=\"ee-oem__list\">\n        <li>Double pin density<\/li>\n        <li>Robustness<\/li>\n        <li>Miniaturization<\/li>\n        <li>Interconnection technology possible (e.g. press-fit)<\/li>\n        <li>High-speed integration<\/li>\n      <\/ul>\n    <\/div>\n\n    <div class=\"ee-oem__col ee-oem__col--mid\">\n      <h3 class=\"ee-oem__head\">Standardization<\/h3>\n      <ul class=\"ee-oem__list\">\n        <li>OPEN interface<\/li>\n        <li>Cost savings<\/li>\n        <li>Flexibility (sealed \/ unsealed)<\/li>\n        <li>Scalability<\/li>\n        <li>Full modularity<\/li>\n      <\/ul>\n    <\/div>\n\n    <div class=\"ee-oem__col\">\n      <h3 class=\"ee-oem__head\">Tier 1 (Wire harness)<\/h3>\n      <ul class=\"ee-oem__list\">\n        <li>UTP \/ STP \/ SPP* cables<\/li>\n        <li>Reduced complexity on the on-board network<\/li>\n        <li>Fewer mating operations on the on-board network<\/li>\n        <li>Automated assembly<\/li>\n        <li>Standardized connectors<\/li>\n      <\/ul>\n    <\/div>\n\n  <\/div>\n\n  <p class=\"ee-oem__note\">* SPP = shielded parallel pair<\/p>\n<\/section>\n\n<p>The development has reached a high level of maturity and is already being successfully used in ECU demonstrators for functional and validation testing. Based on a modular cartridge concept, different signal, data, and power transmission technologies have been integrated into a single demonstrator system and tested under conditions closely resembling real-world applications.<\/p>\n\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\n\t\n\n<\/div>\n<div class=\"message-box relative\" ><div class=\"message-box-bg-image bg-fill fill\" ><\/div><div class=\"message-box-bg-overlay bg-fill fill\" ><\/div><div class=\"container relative\"><div class=\"inner last-reset\">\n\n\t<div id=\"gap-452013533\" class=\"gap-element clearfix\" style=\"display:block; height:auto;\">\n\t\t\n<style>\n#gap-452013533 {\n  padding-top: 30px;\n}\n<\/style>\n\t<\/div>\n\t\n\n<p><strong><span style=\"font-size: 90%;\"><span style=\"font-size: 100%;\">Do you have any questions about this topic, or would you like to learn more about our multi-hybrid connector systems? <\/span><span style=\"font-size: 100%;\">Contact us today &#8211; our team will be happy to assist you:<\/span><br \/><\/span><\/strong><\/p>\n\t<div id=\"gap-110678700\" class=\"gap-element clearfix\" style=\"display:block; height:auto;\">\n\t\t\n<style>\n#gap-110678700 {\n  padding-top: 20px;\n}\n<\/style>\n\t<\/div>\n\t\n\n<a href=\"mailto:product-info@md-elektronik.com\" class=\"button primary is-outline is-smaller\" >\n\t\t<span>Contact<\/span>\n\t<\/a>\n\n\n\t<div id=\"gap-1864188370\" class=\"gap-element clearfix\" style=\"display:block; height:auto;\">\n\t\t\n<style>\n#gap-1864188370 {\n  padding-top: 20px;\n}\n<\/style>\n\t<\/div>\n\t\n\n\n<\/div><\/div><\/div>\n\t<div id=\"gap-521339014\" class=\"gap-element clearfix\" style=\"display:block; height:auto;\">\n\t\t\n<style>\n#gap-521339014 {\n  padding-top: 30px;\n}\n<\/style>\n\t<\/div>\n\t\n\n<div class=\"message-box relative\" style=\"padding-top:30px;padding-bottom:30px;\"><div class=\"message-box-bg-image bg-fill fill\" ><\/div><div class=\"message-box-bg-overlay bg-fill fill\" style=\"background-color:rgb(245, 245, 247);\"><\/div><div class=\"container relative\"><div class=\"inner last-reset\">\n\n<div class=\"row align-equal align-center\"  id=\"row-2131280716\">\n\n\n\t<div id=\"col-1679098856\" class=\"col medium-3 small-12 large-3\"  >\n\t\t\t\t<div class=\"col-inner\"  >\n\t\t\t\n\t\t\t\n\n\t<div id=\"gap-271518352\" class=\"gap-element clearfix\" style=\"display:block; height:auto;\">\n\t\t\n<style>\n#gap-271518352 {\n  padding-top: 10px;\n}\n<\/style>\n\t<\/div>\n\t\n\n\t<div class=\"img has-hover x md-x lg-x y md-y lg-y\" id=\"image_556026972\">\n\t\t\t\t\t\t\t\t<div class=\"img-inner dark\" >\n\t\t\t<img decoding=\"async\" width=\"800\" height=\"800\" src=\"https:\/\/www.md-elektronik.com\/wp-content\/uploads\/2023\/02\/Helmut_Pritz_Web_2026_3_2.jpg\" class=\"attachment-large size-large\" alt=\"\" srcset=\"https:\/\/www.md-elektronik.com\/wp-content\/uploads\/2023\/02\/Helmut_Pritz_Web_2026_3_2.jpg 800w, https:\/\/www.md-elektronik.com\/wp-content\/uploads\/2023\/02\/Helmut_Pritz_Web_2026_3_2-300x300.jpg 300w, https:\/\/www.md-elektronik.com\/wp-content\/uploads\/2023\/02\/Helmut_Pritz_Web_2026_3_2-150x150.jpg 150w, https:\/\/www.md-elektronik.com\/wp-content\/uploads\/2023\/02\/Helmut_Pritz_Web_2026_3_2-768x768.jpg 768w\" sizes=\"(max-width: 800px) 100vw, 800px\" \/>\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\n<style>\n#image_556026972 {\n  width: 99%;\n}\n<\/style>\n\t<\/div>\n\t\n\n\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\n\t\n\n\t<div id=\"col-45763084\" class=\"col medium-9 small-12 large-9\"  >\n\t\t\t\t<div class=\"col-inner\"  >\n\t\t\t\n\t\t\t\n\n<p><span style=\"font-size: 130%;\"><strong>Helmut Pritz<\/strong><\/span><\/p>\n<p>Helmut Pritz is the Product Manager for Fiber Optic Data Transmission and Multi Hybrid Connectors at MD ELEKTRONIK. With over 25 years\u2019 experience in the automotive sector, he has a great deal of expertise to offer in promoting this future-oriented technologies. It is his mission to develop innovative solutions for the automotive industry with customers, startups, control unit manufacturers and suppliers.<br \/>After working as a project manager where he was responsible for developing plug-in components and the associated automation systems, he then took on the role of Manager Development RF Technology and built up a development department which was mainly concerned with high-frequency technology.<br \/>With his global network of customers, suppliers and partners he is starting cross functional cooperations for the development of new technologies and solutions in the area of high-speed data transmission.<\/p>\n\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\n\t\n\n\n<style>\n#row-2131280716 > .col > .col-inner {\n  padding: 0 0px 0px 0px;\n}\n<\/style>\n<\/div>\n\n<\/div><\/div><\/div>\n\n\n","protected":false},"excerpt":{"rendered":"<p>\u25baModularization of Vehicle On-Board Power Systems \u25baHigh Frequency Data Transmission \u25baZonal E\/E Architectures<\/p>\n","protected":false},"author":22,"featured_media":33003,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[25,114],"tags":[],"class_list":["post-33002","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","category-techtalk"],"_links":{"self":[{"href":"https:\/\/www.md-elektronik.com\/en\/wp-json\/wp\/v2\/posts\/33002","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.md-elektronik.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.md-elektronik.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.md-elektronik.com\/en\/wp-json\/wp\/v2\/users\/22"}],"replies":[{"embeddable":true,"href":"https:\/\/www.md-elektronik.com\/en\/wp-json\/wp\/v2\/comments?post=33002"}],"version-history":[{"count":38,"href":"https:\/\/www.md-elektronik.com\/en\/wp-json\/wp\/v2\/posts\/33002\/revisions"}],"predecessor-version":[{"id":33185,"href":"https:\/\/www.md-elektronik.com\/en\/wp-json\/wp\/v2\/posts\/33002\/revisions\/33185"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.md-elektronik.com\/en\/wp-json\/wp\/v2\/media\/33003"}],"wp:attachment":[{"href":"https:\/\/www.md-elektronik.com\/en\/wp-json\/wp\/v2\/media?parent=33002"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.md-elektronik.com\/en\/wp-json\/wp\/v2\/categories?post=33002"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.md-elektronik.com\/en\/wp-json\/wp\/v2\/tags?post=33002"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}